George Shaw
Senior Consultant
IC Package/Process Design and Manufacturing
George Shaw joins NeoKinetics as a member of our senior staff and brings his expertise gained from over 35 years in semiconductor assembly and test to support our clients with product/process design, engineering and strategic technical management.
Mr. Shaw began his career with National Semiconductor’s (NSC) Package Engineering group. Later he served off-shore for NSC as Managing Director in both Indonesia and Thailand before completing his thirteen years with NSC as Vice President of Package Engineering. Shaw was also the VP of Operations for start-up Aptix Corp where he lead the successful market introduction of a 1024 I/O Flip Chip custom interconnect component.
George has extensive ex-patriot experience (20 years in 6 Southeast Asian countries) as a Managing Director of assembly and test facilities for both IDM and subcontract companies. Shaw’s positions
have also included senior and executive management positions with Psi Technologies, Inc., Amkor
Technology, Alphatec USA, ASAT, and AIT Hong Kong. He has managed multiple strategic projects,
including new facility design, construction and activation and has effected corporate performance/quality improvements throughout his career.
Although many of his achievements have been at the corporate level, George has maintained a close
association with the technical aspects of Package and Assembly Process Engineering. He has specified design, materials, process and equipment requirements for QFN, BGA, MEMS and Multi- Chip packages and developed package design rules and roadmaps for several categories of device
technology.
Mr. Shaw holds a BSME from Cal Poly and has completed Executive Development study at Stanford University and The University of Singapore.